Thermal array with gimbal features and enhanced thermal performance
US12210056B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2023 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Oct 10, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2863
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts can be disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.