Patent assignee · US · COMPANY

Advantest Test Solutions, Inc.

31Patents
31Active
31Granted
64Portfolio score

Filing activity: Jul 16, 2017 → Dec 11, 2023

Most-cited patents

PatentTitleAreaCited byStatus
US10656200B2 High volume system level testing of devices with pop structures Physics 28 Active
US11493551B2 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation Physics 20 Active
US11674999B2 Wafer scale active thermal interposer for device testing Physics 9 Active
US11567119B2 Testing system including active thermal interposer device Physics 8 Active
US11573262B2 Multi-input multi-zone thermal control for device testing Physics 5 Active
US11587640B2 Carrier based high volume system level testing of devices with pop structures Physics 3 Active
US11835549B2 Thermal array with gimbal features and enhanced thermal performance Physics 3 Active
US11852678B2 Multi-input multi-zone thermal control for device testing Physics 2 Active
US11821913B2 Shielded socket and carrier for high-volume test of semiconductor devices Physics 2 Active
US12174248B2 Ergonomic loading for a test interface board (TIB) / burn-in-board (BIB) in a slot-based test system Physics 2 Active
US11754620B2 DUT placement and handling for active thermal interposer device Physics 1 Active
US11742055B2 Carrier based high volume system level testing of devices with pop structures Physics 1 Active
US12203979B2 Multi-input multi-zone thermal control for device testing Physics 0 Active
US11846669B2 Active thermal interposer device Physics 0 Active
US12203958B2 Shielded socket and carrier for high-volume test of semiconductor devices Physics 0 Active
US11609266B2 Active thermal interposer device Physics 0 Active
US12235315B2 Test system support component exchange system and method Physics 0 Active
US11808812B2 Passive carrier-based device delivery for slot-based high-volume semiconductor test system Physics 0 Active
US12374420B2 Carrier based high volume system level testing of devices with pop structures Physics 0 Active
US12210056B2 Thermal array with gimbal features and enhanced thermal performance Physics 0 Active
US11940487B2 Thermal solution for massively parallel testing Physics 0 Active
US11549981B2 Thermal solution for massively parallel testing Physics 0 Active
US12320852B2 Passive carrier-based device delivery for slot-based high-volume semiconductor test system Physics 0 Active
US12216154B2 Active thermal interposer device Physics 0 Active
US11841392B2 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation Physics 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.