Semiconductor encapsulant strength enhancer
US12218018B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | May 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/072
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, a power semiconductor die mounted on the power electronics carrier, a housing that surrounds an interior volume over the power electronics carrier, a reinforcing structure contained within the interior volume and including a textured surface that is accessible by fluid, a volume of curable encapsulant disposed within the interior volume and encapsulating the power semiconductor die, wherein the reinforcing structure is embedded within the volume of curable encapsulant such that the textured surface adheres to the encapsulant, and wherein the reinforcing structure has a tensile strength that is greater than a tensile strength of the curable encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.