Wafer transfer apparatus with aligner
US12224191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2023 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Mar 10, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G47/915
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.