Electronic device
US12224226B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Mar 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.