Magnetic core inductors in interposer
US12224252B2 · kind B2 · utility
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1References
25Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 23, 2020 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jun 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.