Clamped semiconductor wafers and semiconductor devices
US12224259B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jun 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Clamped semiconductor wafers and clamped semiconductor devices include reservoirs filled with a flowable metal which hardens to allow the wafers/devices to be shipped or stored. The hardened metal may also be reflowed to a liquid to allow clamping of the semiconductor wafers together and to allow clamping of the semiconductor packages together. The flowable metal may be filled into the reservoirs as a liquid or paste. Thereafter, the flowable metal may be cooled to harden the flowable metal into a clamping member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.