Manufacturing method and manufacturing apparatus for interconnection member
US12224366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2020 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
The present disclosure discloses a manufacturing method and a manufacturing device for an interconnection piece. The manufacturing method comprises providing a solder strip, and performing forming treatment on the solder strip to obtain a plurality of structural solder strips; and providing a flexible insulating substrate, and compounding the plurality of structural solder strips on the flexible insulating substrate at intervals to obtain the interconnection piece. Each structural solder strip is provided with two soldering portions and a connecting portion located between the two soldering portions, and the connecting portion is respectively connected to the two soldering portions; at least a part of the connecting portion is located on the flexible insulating substrate, and the two soldering portions extend out of the flexible insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.