Compact paired parallel architecture for high-fidelity haptic applications
US12226892B2 · kind B2 · utility
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Key dates
| Filing date | Sep 7, 2021 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Apr 20, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/40195
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A versatile, compact, and high-fidelity haptic device is provided. The mechanical transparency of the design and the selection of proper actuation meet the challenges of an accurate and stiff haptic device with high and isotropic force capability. Such a haptic interface enables a precise remote control and provides perfect sense of the task interaction in any environments and applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.