Wafer probe device
US12228590B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Sep 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An wafer probe device is provided, including a holder, and a probe card. The holder has a holding surface for holding a wafer. The probe card has a probing side for probing the wafer. Wherein the holder and the probe card are disposed on the ground, and the holding surface of the holder and the probing side of the probe card are perpendicular to the ground. Wherein when the holder holds the wafer to move upwardly toward the probe card into a probing position, the probed surface of the wafer is in contact with the probe card, and the probe surface is perpendicular to the ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.