Wafer bin map based root cause analysis
US12229945B2 · kind B2 · utility
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4References
19Claims
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Key dates
| Filing date | Aug 3, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 3, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.