Substrate embedded magnetic core inductors and method of making
US12230430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jun 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.