Electronic device with solder interconnect and multiple material encapsulant
US12231109B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2021 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1085
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.