Printed circuit board and manufacturing method thereof
US12232254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2022 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Mar 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.