Component placement systems and methods of operating the same
US12232271B2 · kind B2 · utility
0Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0411
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.