Computing center and method
US12232295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2020 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Oct 18, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a computing center that includes a computing system disposed in a chamber. The computing system includes a plurality of cooling elements and a plurality of processors, each processor thermally coupled to a cooling element of the plurality of cooling elements. The computing also center includes at least one heat pump disposed in the chamber; at least one gas-liquid exchanger disposed in the chamber. The also computing center includes a hot liquid circuit coupling the plurality of cooling elements to the gas-liquid exchanger, the hot liquid circuit further comprising a hot liquid connection on a wall of the chamber and a cold liquid circuit coupling the heat pump to the gas-liquid exchanger, wherein the heat pump is configured to extract thermal energy from the cold liquid circuit and supply it to the hot liquid circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.