Deposition apparatus, deposition target structure, and method
US12237159B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 22, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0337
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A deposition apparatus includes a process chamber, a wafer support in the process chamber, a backplane structure having a first surface in the process chamber facing the wafer support, a target having a second surface facing the first surface and a third surface facing the wafer support, and an adhesion structure in physical contact with the backplane structure and the target. The adhesion structure has an adhesion material layer, and a spacer embedded in the adhesion material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.