Substrate processing apparatus and substrate processing method
US12237178B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Dec 21, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes: a processing container to which a supercritical fluid is supplied, the processing container being configured to dry a substrate by replacing a drying liquid collected on the substrate with the supercritical fluid; a discharge line configured to discharge a mixed fluid containing the supercritical fluid and the drying liquid from an interior of the processing container; and a density detector configured to detect a density of the mixed fluid flowing through the discharge line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.