Solder reflow apparatus and method of manufacturing an electronic device
US12237297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2023 |
| Grant date | Feb 25, 2025 |
| Priority date | — |
| Expiry date | May 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75981
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.