Junga Lee
6Patents
0h-index
21Co-inventors
34Inventor score
Filing activity: Jun 18, 2020 → Mar 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12237297B2 | Solder reflow apparatus and method of manufacturing an electronic device | Electricity | 0 | Active |
| US12205925B2 | Semiconductor package having package substrate | Electricity | 0 | Active |
| US11742294B2 | Interposers and semiconductor packages including the same | Electricity | 0 | Active |
| US12257566B2 | Carbon dioxide absorbent including phenolate-based ionic liquid and aliphatic alcohol and method of separating carbon dioxide using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11358382B2 | Pad printing device | Performing Operations; Transporting | 0 | Active |
| US12382672B2 | Epitaxial wafer and semiconductor memory device using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.