Holding system for holding substrates during a processing of the surfaces of the substrates
US12241154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2020 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Aug 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B13/0242
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a holding system (1) for holding substrates (12) for use in a surface processing system having a covering area (20), comprising a plurality of fixing elements (2), a body (24) arranged within the covering area (20) for receiving the fixing elements (2), and a positioning element (26) for adjusting the covering and a machining area (20, 22), wherein a plurality of substrates (12) can be fixed by the fixing elements (2) and processed within the machining area (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.