Multi-layer planar waveguide interconnects
US12242102B2 · kind B2 · utility
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Key dates
| Filing date | Oct 12, 2023 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Oct 12, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.