Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die
US12242123B1 · kind B1 · utility
0Cited by
67References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2023 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Dec 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. A coupler is bonded to a first surface of the first die, an optical fiber is coupled to the coupler for coupling light from the optical fiber to the quantum circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.