Thermal management in horizontally or vertically stacked dies
US12242315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2021 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jul 3, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal management scheme, for a multichip module, that is aware of various dies in a stack (horizontal and/or vertical) and heat generated from them, local hot spots in a victim die, and hot spots in aggressor die(s). Each victim die receives telemetry information from thermal sensors located in aggressor dies as well as local thermal sensors in the victim die. The telemetry information is used to enable a virtual sensing scheme where temperature for a target die (e.g., a victim die) and/or its intellectual property (IP) domain is estimated or calculated. The estimated or calculated temperature is then used for performance management of the victim and/or aggressor dies in the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.