Offset pads over TSV
US12243851B2 · kind B2 · utility
1Cited by
225References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2023 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | Jul 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06544
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Representative techniques and devices including process steps may be employed to mitigate the potential for delamination of bonded microelectronic substrates due to metal expansion at a bonding interface. For example, a metal pad may be disposed at a bonding surface of at least one of the microelectronic substrates, where the contact pad is positioned offset relative to a TSV in the substrate and electrically coupled to the TSV.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.