Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled
US12245377B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Oct 10, 2022 |
| Grant date | Mar 4, 2025 |
| Priority date | — |
| Expiry date | May 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier includes a stack having at least one horizontal electrically conductive layer structure, at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and at least one vertical via being laterally offset from the semiconductor component. The at least one horizontal electrically conductive layer structure electrically connects the vertical via to a bottom main surface of the semiconductor component. The component carrier is configured for a current flow from the vertical via to the horizontal electrically conductive layer structure, from the horizontal electrically conductive layer structure to the bottom main surface of the semiconductor component, from the bottom main surface of the semiconductor component to an upper main surface of the semiconductor component, and from the upper surface of the semiconductor component to the outside of the component carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.