Patent · US Active

Method of preparing a high density interconnect printed circuit board including microvias filled with copper

US12245383B2 · kind B2 · utility

0Cited by

3References

12Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Bert Reents · Berlin, DE
Akif Özkök · Berlin, DE
Soungsoo Kim · Berlin, DE
Horst Brüggmann · Berlin, DE
Herwig Josef BERTHOLD · Berlin, DE
Marcin Klobus · Berlin, DE
Thomas Schiwon · Berlin, DE
Marko Mirkovic · Berlin, DE

Key dates

Filing date	Aug 19, 2020
Grant date	Mar 4, 2025
Priority date	—
Expiry date	Jun 4, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1492
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.