Polishing pad and method of fabricating semiconductor device using the same
US12246408B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2021 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Mar 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to an endpoint detection window of a polishing pad for use in a polishing process. The polishing pad may prevent an error in detection of the endpoint of the polishing process by preventing a difference in endpoint detection performance from occurring due to a difference in the wavelength of a laser between polishing apparatuses. The present disclosure may also provide a method of fabricating a semiconductor device using the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.