Plating apparatus and plating process method
US12247311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2020 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Sep 20, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a technique that ensures suppressed deterioration of plating quality of a substrate due to a process gas that remains on a lower surface of a membrane.A plating apparatus 1000 includes a plating tank 10 and a substrate holder 30. The plating tank includes an anode 11 arranged in an anode chamber 13. The substrate holder is arranged above the anode chamber and configured to hold a substrate Wf as a cathode. The anode has a cylindrical shape extending in a vertical direction. The plating apparatus further includes a gas accumulation portion 60 and a discharge mechanism 70. The gas accumulation portion is disposed in the anode chamber so as to have a space between the anode and the gas accumulation portion. The gas accumulation portion covers an upper end, an outer peripheral surface, and an inner peripheral surface of the anode to accumulate a process gas generated from the anode. The discharge mechanism is configured to discharge the process gas accumulated in the gas accumulation portion to outside of the plating tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.