Integrated structure with bifunctional routing and assembly comprising such a structure
US12249572B2 · kind B2 · utility
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2References
13Claims
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Key dates
| Filing date | Sep 20, 2021 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Nov 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated structure intended to connect a plurality of semiconductor devices, the integrated structure including a substrate, a first face and a second face, the first face being intended to receive the semiconductor devices, the integrated structure including, at the first face, at least one routing level, the routing level or levels including: at least one first conductor routing track in a conductor material; and at least one first superconductor routing track made from a superconductor material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.