SIP package structure
US12249582B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | Mar 11, 2025 |
| Priority date | — |
| Expiry date | Oct 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an SIP package structure. The SIP package structure comprises a first module, a second module and a shielding assembly, wherein the first module and the second module are horizontally distributed or vertically stacked; electromagnetic sensitive frequencies of the first module and the second module are different; the shielding assembly comprises a first shielding structure covering the first module and a second shielding structure covering the second module; and at least part of the first shielding structure and/or at least part of the second shielding structure are/is disposed between the first module and the second module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.