Danfeng Yang
3Patents
0h-index
8Co-inventors
24Inventor score
Filing activity: May 20, 2020 → Nov 20, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11854949B2 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Electricity | 0 | Active |
| US12249582B2 | SIP package structure | Electricity | 0 | Active |
| US12148681B2 | Fan-out package structure and method for manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.