Patent · US Active

Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes

US12251767B2 · kind B2 · utility

0Cited by

5References

7Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Peter Wiesner · Simbach, DE
Wolfgang Gmach · Emmerting, DE
Robert Kreuzeder · Wurmannsquick, DE

Key dates

Filing date	May 20, 2021
Grant date	Mar 18, 2025
Priority date	—
Expiry date	Feb 2, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/045
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.