Packaging film and preparation method thereof, and filter chip packaging method
US12252613B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2024 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Oct 30, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/005
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.