Substrate processing method
US12255082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Sep 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method arranges a plurality of substrates in a storage area of a chamber, supplies an organic solvent to the plurality of substrates, arranges the plurality of substrates in a drying area, supplies a vapor of a hydrophobizing agent from a hydrophobizing agent nozzle to the plurality of substrates, arranges the plurality of substrates in the storage area, supplies an organic solvent from a first organic solvent nozzle to the plurality of substrates, supplies a vapor of an organic solvent from a second organic solvent nozzle to the drying area in a state where a liquid is stored in the storage area and the plurality of substrates are dipped in a liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.