Jet impingement cooling with bypass fluid portion for high power semiconductor devices
US12255124B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2023 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Sep 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cooling assembly may further include an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles, and at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.