Wafer warpage regulation epoxy functional film, and preparation method and application thereof
US12255175B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2024 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Aug 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided in the present invention is a wafer warpage regulation epoxy functional film. The wafer warpage regulation epoxy functional film includes the raw material components, in percentage by mass, 33% of an epoxy resin, 50%-52% of silica, 12%-14% of a curing agent, 1% of a curing accelerator, and 2% of a coloring agent; and the epoxy resin includes a bisphenol F-type epoxy resin and a phenolic epoxy resin. Besides, the above raw material components are stirred and mixed to obtain a slurry, the slurry is coated to a back of a wafer body, and after curing, the epoxy functional film which is formed by the phenolic epoxy resin has high shrinkage and large warpage, to drive the back of the wafer body to warp so as to drive a front of the wafer body to warp backwards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.