Semiconductor device
US12255254B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 5, 2023 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor device includes: a semiconductor layer including a first plane extending along a plane including a first axis and a second axis; a first electrode extending along the first axis; a second electrode extending along the second axis; and a third electrode above the first plane. The third electrode is electrically coupled to the first electrode and the second electrode, and includes a first portion, a second portion and a third portion. The first portion crosses the first electrode. The second portion crosses the second electrode. The third portion crosses the second electrode and is separate at a first end from the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.