Light-emitting diode package structure and manufacturing method thereof
US12255279B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2022 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | May 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.