Circuit board structure
US12256488B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2023 |
| Grant date | Mar 18, 2025 |
| Priority date | — |
| Expiry date | Dec 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.