Apparatus and method for wafer cleaning
US12257610B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2024 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Jan 26, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/32
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.