Soldering quality inspection method and soldering quality inspection apparatus
US12260541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2022 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Sep 20, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.