Patent · US Active

Plasma treatment apparatus, lower electrode assembly and forming method thereof

US12261012B2 · kind B2 · utility

0Cited by

5References

8Claims

0Family size

Assignee

ADVANCED MICRO-FABRICATION EQUIPMENT INC. · CN

Inventors

Tuqiang Ni · Fremont, US
Sheng Guo · San Mateo, US
Xiang Sun · Newark, US
Guangwei Fan · Shanghai, CN
Kuan-Yu Yang · Shanghai, CN
Hongqing V. Wang · North Myrtle Beach, US
Xingjian CHEN · Shanghai, CN
Ruoxin Du · Shanghai, CN

Key dates

Filing date	Feb 24, 2022
Grant date	Mar 25, 2025
Priority date	—
Expiry date	Oct 6, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/3065
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Disclosed is a plasma treatment apparatus, a lower electrode assembly and a forming method thereof, wherein the lower electrode assembly includes: a base for carrying a substrate to be treated; a focus ring encircling a periphery of the base; a coupling loop disposed below the focus ring; a conductive layer disposed in the coupling loop; and a wire for electrically connecting the conductive layer and the base so that the base and the conducting layer are equipotential. The lower electrode assembly is less prone to cause arc discharge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.