Semiconductor package having an encapulant comprising conductive fillers and method of manufacture
US12261095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2023 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | Nov 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.