Sam Vaziri
3Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Jun 19, 2020 → Nov 1, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11842946B2 | Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture | Electricity | 1 | Active |
| US11908690B2 | Multi-layered semiconductive device and methodology with polymer and transition metal dichalcogenide material | Electricity | 0 | Active |
| US12261095B2 | Semiconductor package having an encapulant comprising conductive fillers and method of manufacture | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.