Method for producing an optoelectronic device
US12261249B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Oct 1, 2020 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | May 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an optoelectronic device including assemblies of light-emitting diodes (LED) having first and second assemblies and first blocks made of a first photoluminescent material, each covering one of the first assemblies. The method includes the forming of a layer covering the first and second assemblies, the delimiting of first openings in the layer to expose the first assemblies, the filling of the first openings with the first material, and the performing of a chemical-mechanical polishing to delimit the first blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.