Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods

US12261583B2 · kind B2 · utility

Assignee

• RF360 Singapore Pte. Ltd. · SG

Inventors

• Simone Colasanti · Bayern, DE
• Nadine Erhard-Egeler · Munich, DE
• Stefan Leopold Hatzl
• Manuel Hofer · Wolfsberg, AT
• Peter Kirchhofer · Munich, DE
• Volker Schulz · Heppenheim, DE

Key dates

• Filing date: Feb 4, 2022
• Grant date: Mar 25, 2025
• Expiry date: May 12, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03H9/725
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.