Manuel Hofer
6Patents
0h-index
25Co-inventors
37Inventor score
Filing activity: Oct 30, 2017 → Dec 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10582609B2 | Integration of through glass via (TGV) filter and acoustic filter | Electricity | 0 | Active |
| US12341488B2 | Package comprising an acoustic device and a polymer cap layer | Electricity | 0 | Active |
| US12071339B2 | Micro-acoustic wafer-level package and method of manufacture | Performing Operations; Transporting | 0 | Active |
| US12261583B2 | Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods | Electricity | 0 | Active |
| US12334909B2 | Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods | Electricity | 0 | Active |
| US12316304B2 | Vertically coupled SAW resonators | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.