Reprint apparatus for circuit board and reprint method using the same
US12262477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2023 |
| Grant date | Mar 25, 2025 |
| Priority date | — |
| Expiry date | May 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.