Hermetic package for high CTE mismatch
US12266582B2 · kind B2 · utility
0Cited by
4References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2021 |
| Grant date | Apr 1, 2025 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a hermetic package capable of handling a high coefficient of thermal expansion (CTE) mismatch configuration. The disclosed hermetic package includes a metal base and multiple segments that are discrete from each other. Herein, a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material. The ceramic wall segments with the connecting material form a ring wall, where the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall. The metal base is either surrounded by the ring wall or underneath the ring wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.